LHG3392-R1-PF datasheet(7/7 Pages) LIGITEK

7 / 7 page

1.T.Sol=230

℃±5℃

2.Dwell time=5

±1sec

1.Ta=105

℃±5℃&-40℃±5℃

(10min) (10min)

2.total 10 cycles

1.T.Sol=260

℃±5℃

2.Dwell time= 10

±1sec.

1.Ta=65

℃±5℃

2.RH=90 %~95%

3.t=240hrs

±2hrs

Solderability Test

Thermal Shock Test

Solder Resistance

Test

High Temperature

High Humidity Test

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

This test intended to see soldering well

performed or not.

MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

The purpose of this is the resistance of

the device to sudden extreme changes

in high and low temperature.

MIL-STD-202: 107D

MIL-STD-750: 1051

MIL-STD-883: 1011

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1

The purpose of this test is the resistance

of the device under tropical for hours.

MIL-STD-202:103B

JIS C 7021: B-11

1.Under Room Temperature

2.If=20mA

3.t=1000 hrs (-24hrs, +72hrs)

1.Ta=-40

℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

1.Ta=105

℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

Test Condition

Operating Life Test

Low Temperature

Storage Test

High Temperature

Storage Test

Test Item

Reliability Test:

6/6

Page

This test is conducted for the purpose

of detemining the resistance of a part

in electrical and themal stressed.

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

The purpose of this is the resistance of

the device which is laid under condition

of high temperature for hours.

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

JIS C 7021: B-12

MIL-STD-883:1008

JIS C 7021: B-10

Description

Reference

Standard

LIGITEK ELECTRONICS CO.,LTD.

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LHG3392/R1-PF

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