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MPXV6115VC6U Folha de dados(PDF) 6 Page - Freescale Semiconductor, Inc

Nome de Peças MPXV6115VC6U
Descrição Electrónicos  High Temperature Accuracy Integrated Silicon Pressure Sensor
PDF  8 Pages
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Fabricante Electrônico  FREESCALE [Freescale Semiconductor, Inc]
Página de início  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPXV6115VC6U Folha de dados(HTML) 6 Page - Freescale Semiconductor, Inc

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MPXV6115V
Sensors
6
Freescale Semiconductor
Pressure
SURFACE MOUNTING INFORMATION
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
Figure 5. SOP Footprint (Case 482A)
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP
2.54
0.300
7.62
inch
mm



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