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MAX14770E Folha de dados(PDF) 2 Page - Maxim Integrated Products

Nome de Peças MAX14770E
Descrição Electrónicos  High-ESD Profibus RS-485 Transceiver
PDF  15 Pages
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Fabricante Electrônico  MAXIM [Maxim Integrated Products]
Página de início  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX14770E Folha de dados(HTML) 2 Page - Maxim Integrated Products

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High-ESD Profibus RS-485 Transceiver
2 ______________________________________________________________________________________
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to GND.)
VCC.......................................................................-0.3V to +6.0V
RE, RO.......................................................-0.3V to (VCC + 0.3V)
DE, DI ...................................................................-0.3V to +6.0V
A, B.....................................................................-8.0V to +13.0V
Short-Circuit Duration (RO, A, B) to GND .................Continuous
Continuous Power Dissipation (TA = +70NC)
8-Pin SOIC (derate 7.6mW/NC above +70NC) ............606mW
8-Pin TDFN (derate 24.4mW/NC above +70NC)........1951mW
Junction-to-Ambient Thermal Resistance (BJA) (Note 1)
8-Pin SO....................................................................132NC/W
8-Pin TDFN..................................................................41NC/W
Junction-to-Case Thermal Resistance (BJC) (Note 1)
8-Pin SO......................................................................38NC/W
8-Pin TDFN....................................................................8NC/W
Operating Temperature Range
8-Pin SO......................................................... -40NC to +85NC
8-Pin TDFN................................................... -40NC to +125NC
Storage Temperature Range............................ -65NC to +150NC
Junction Temperature Range........................... -40NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
ELECTRICAL CHARACTERISTICS
(VCC = +5V Q10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +5V, TA = +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic/thermal-tutorial.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Power-Supply Range
VCC
4.5
5.5
V
Supply Current
ICC
DE = 1, RE = 0 or
DE = 0, RE = 0 or
DE = 1, RE = 1; no load
2.5
4
mA
Shutdown Supply
Current
ISH
DE = 0, RE = 1
15
F
A
DRIVER
Differential Driver
Output
|VOD|
RL = 54I, VDI = VCC or GND; Figure 1
2.1
V
Differential Driver
Peak-to-Peak Output
VODPP
Figure 2 (Note 3)
4.0
6.8
V
Change in Magnitude
of Differential Output
Voltage
D
VOD
RL = 54I; Figure 1 (Note 4)
-0.2
0
+0.2
V
Driver Common-
Mode Output Voltage
VOC
RL = 54I; Figure 1
1.8
3
V
Change in Common-
Mode Voltage
D
VOC
RL = 54I; Figure 1 (Note 4)
-0.2
+0.2
V
Driver Short-Circuit
Output Current
(Note 5)
IOSD
0V P VOUT P +12V; output low
+250
mA
-7V P VOUT P VCC; output high
-250
Driver Short-Circuit
Foldback Output
Current (Note 5)
IOSDF
(VCC - 1V) P VOUT P +12V; output low
-15
mA
-7V P VOUT P +1V; output high
+15



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