AD6657EBZ datasheet(9/32 Pages) AD

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AD6657

Rev. 0 | Page 9 of 32

ABSOLUTE MAXIMUM RATINGS

THERMAL CHARACTERISTICS

Table 6.

Parameter

Rating

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to AGND

−0.3 V to +2.0 V

VIN+x, VIN−x to AGND

−0.3 V to AVDD + 0.2 V

CLK+, CLK− to AGND

−0.3 V to AVDD + 0.2 V

SYNC to AGND

−0.3 V to AVDD + 0.2 V

VCMx to AGND

−0.3 V to AVDD + 0.2 V

CSB to AGND

−0.3 V to DRVDD + 0.2 V

SCLK to AGND

−0.3 V to DRVDD + 0.2 V

SDIO to AGND

−0.3 V to DRVDD + 0.2 V

PDWN to AGND

−0.3 V to DRVDD + 0.2 V

MODE to AGND

−0.3 V to DRVDD + 0.2 V

Digital Outputs to AGND

−0.3 V to DRVDD + 0.2 V

DCO+AB, DCO−AB, DCO+CD,

DCO−CD to AGND

−0.3 V to DRVDD + 0.2 V

Operating Temperature Range

(Ambient)

−40°C to +85°C

Maximum Junction Temperature

Under Bias

150°C

Storage Temperature Range

(Ambient)

−65°C to +150°C

The values in Table 7 are per JEDEC JESD51-7 plus JEDEC

JESD25-5 for a 2S2P test board. Typical θJA is specified for a

4-layer PCB with a solid ground plane. As shown in Table 7,

airflow improves heat dissipation, which reduces θJA. In addi-

tion, metal in direct contact with the package leads from metal

traces, through holes, ground, and power planes reduces θJA.

Table 7.

Package Type

Airflow

Velocity

θJA1

θJC2

θJB3

Unit

144-Ball CSP_BGA,

10 mm × 10 mm

(BC-144-1)

0 m/s

26.9

8.9

6.6

°C/W

1 m/s

24.2

2.5 m/s

23.0

1 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

2 Per MIL-STD 883, Method 1012.1.

3 Per JEDEC JESD51-8 (still air).

The values in Table 8 are from simulations. The PCB is a JEDEC

multilayer board. Thermal performance for actual applications

requires careful inspection of the conditions in the application

to determine whether they are similar to those assumed in these

calculations.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Table 8.

Package Type

Airflow

Velocity

Unit

144-Ball CSP_BGA,

10 mm × 10 mm

(BC-144-1)

0 m/s

14.4

0.23

°C/W

1 m/s

14.0

0.50

2.5 m/s

13.9

0.53

ESD CAUTION

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