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MPC8377ECVRALDA Folha de dados(PDF) 87 Page - Freescale Semiconductor, Inc

Nome de Peças MPC8377ECVRALDA
Descrição Electrónicos  PowerQUICC??II Pro Processor Hardware Specifications
PDF  124 Pages
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Fabricante Electrônico  FREESCALE [Freescale Semiconductor, Inc]
Página de início  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8377ECVRALDA Folha de dados(HTML) 87 Page - Freescale Semiconductor, Inc

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MPC8377E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
87
Package and Pin Listings
Figure 63 shows the mechanical dimensions and bottom surface nomenclature of the TEPBGA II package.
Figure 63. Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II
Note:
1 All dimensions are in millimeters.
2 Dimensioning and tolerancing per ASME Y14. 5M-1994.
3 Maximum solder ball diameter measured parallel to Datum A.
4 Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5 Parallelism measurement should exclude any effect of mark on top surface of package.
22.2
Pinout Listings
Table 71 provides the pin-out listing for the TePBGA II package.
Table 71. TePBGA II Pinout Listing
Signal
Package Pin Number
Pin Type
Power Supply
Notes
Clock Signals
CLKIN
K24
I
OVDD
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