STM8L151C4 datasheet(58/101 Pages) STMICROELECTRONICS

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Electrical parameters

STM8L151xx, STM8L152xx

58/101

Doc ID 15962 Rev 2

8.3

Operating conditions

Subject to general operating conditions for VDD and TA.

8.3.1

General operating conditions

Table 15.

General operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

fSYSCLK

(1)

System clock

frequency

1.65 V

≤VDD < 3.6 V

MHz

VDD

Standard operating

voltage

1.65(2)

3.6

VDDA

Analog operating

voltage

ADC not used

Must be at the same

potential as VDD

1.65(2)

3.6

ADC used

1.8

3.6

(3)

Power dissipation at

TA= 85 °C for suffix 6

devices

VFQFPN48 (4)

TBD

LQFP48

TBD

WFQFPN32 (5)

TBD

LQFP32

TBD

WFQFPN28 (6)

TBD

Power dissipation at

TA= 125 °C for suffix 3

devices

VFQFPN48(4)

TBD

LQFP48

TBD

WFQFPN32(5)

TBD

LQFP32

TBD

WFQFPN28(6)

TBD

Temperature range

1.65 V

≤VDD < 3.6 V

(6 suffix version)

-40

°C

1.65 V

≤VDD < 3.6 V

(3 suffix version)

-40

125

Junction temperature

range

-40 °C

≤TA < 85 °C

(6 suffix version)

-40

105

°C

-40 °C

≤ TA < 125 °C

(3 suffix version)

-40

130

fSYSCLK = fCPU

1.8 V at power-up, 1.65 V at power-down if BOR is disabled.

To calculate PDmax(TA), use the formula PDmax=(TJmax -TA)/

JA with TJmax in this table and

JA in “Thermal characteristics”

table.

VFQFPN48 package is used in the sampling phase. In the production phase, the UFQFPN48 package will be used (with a

thickness equal to 0.6 mm).

WFQFPN32 package is used in the sampling phase. In the production phase, the UFQFPN32 package will be used (with a

thickness equal to 0.6 mm).

WFQFPN28 package is used in the sampling phase. In the production phase, the UFQFPN28 package will be used (with a

thickness equal to 0.6 mm).

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