• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

4

GaAs SPST Switch

DC - 6.0 GHz

Rev. V5

MASW6020G

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Mounting

The MASW6020G is back-metallized with Pd/Ni/Au

(100/1,000, 10,000 Å) metallization. It can be die-

mounted with AuSn eutectic preforms or with

thermally conductive epoxy. The package surface

should be clean and flat before attachment.

Eutectic Die Attach:

A. A 80/20 gold/tin preform is recommended with

a work surface temperature of approximately

255°C and a tool temperature of 265°C. When

not 90/10 nitrogen/hydrogen gas is applied,

tool tip temperature should be approximately

290°C.

B. DO NOT expose the MASW6020G to a

temperature greater than 320°C for more than

20 seconds.

No more than 3 seconds for

scrubbing should be required for attachment.

Epoxy Die Attach:

A. Apply a minimum amount of epoxy and place

the MASW6020G into position. A thin epoxy

fillet should be visible around the perimeter of

the chip.

B. Cure epoxy per manufacturer’s recommended

schedule.

C. Electrically conductive epoxy may be used by

is not required.

Wire Bonding

A. Ball or wedge with 1.0 mil diameter pure gold

wire. Thermosonic wirebonding with a nominal

stage temperature of 150°C and a ball bonding

force of 40 to 50 grams or wedge bonding force

o1 18 to 22 grams is recommended. Ultrasonic

energy and time should be adjusted to the

minimum levels achieve reliable wirebonds.

B. Wirebonds should be started on the chip and

terminated on the package.

Handling Precautions

Permanent damage to the MASW6020G may

occur if the following precautions are not adhered

to:

A. Cleanliness—MASW6020G should be handled

in a clean environment.

DO NOT attempt to

clean unit after the MASW6020G is installed.

B. Static Sensitivity—All chip handling equipment

and personnel should be DC grounded.

C. Transient—Avoid instrument and power supply

transients

while

bias

is

applied

to

the

MASW6020G.

Use shielded signal and bias

cables to minimize inductive pick-up.

D. Bias—Apply

voltage

to

either

of

the

complementary control ports only when the

other is grounded. No port should be allowed to

“float”.

E. General Handling—It is recommended that the

MASW6020G chip be handled along the long

side of the die with a sharp pair of bent

tweezers.

DO NOT touch the surface of the

chip with fingers or tweezers.

Handling Procedures

Please observe the following precautions to avoid

damage:

Static Sensitivity

Gallium Arsenide Integrated Circuits are sensitive

to electrostatic discharge (ESD) and can be

damaged by static electricity. Proper ESD control

techniques should be used when handling these

devices.