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JS SERIES

1. General Information

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Relays produced after the specific date code that is indicated on each data sheet are lead-free

now. All of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.

(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)

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Lead free solder plating currently used in relays is Sn-3.0Ag-0.5Cu.

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All signal and power relays also comply with RoHS. Please refer to individual data

sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials above the threshold level

that are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE).

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It has been verified that using lead-free relays in leaded assembly process will not cause any

problems (compatible).

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“LF” is marked on each outer and inner carton. (No marking on individual relays).

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To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.

Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC)

2. Recommended Lead Free Solder Profile

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Recommended solder paste Sn-3.0Ag-0.5Cu.

RoHS Compliance and Lead Free Relay Information

Solder condition

3. Moisture Sensitivity

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Moisture Sensitivity Level standard is not applicable to through hole electromechanical relays.

4. Tin Whisker

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Dipped SnAgCu solder is known as low risk tin whisker. No considerable length whisker was found by our in

house test.

We highly recommend that you confirm your actual solder conditions

Flow Solder condition:

Pre-heating:

maximum 120˚C

Soldering:

dip within 5 sec. at

260˚C solder bath

Solder by Soldering Iron:

Soldering Iron

Temperature: maximum 360˚C

Duration:

maximum 3 sec.