TLE2084AMFK datasheet(6/69 Pages) TI

Nome de Peças	TLE2084AMFK

Descrição Electrónicos	EXCALIBUR HIGH-SPEED JFET-INPUT OPERATIONAL AMPLIFIERS

PDF	69 Pages

Scroll/Zoom	100%

Fabricante Electrônico	TI [Texas Instruments]

Página de início	http://www.ti.com

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6 / 69 page

TLE208x, TLE208xA, TLE208xY

EXCALIBUR HIGH-SPEED JFET-INPUT

OPERATIONAL AMPLIFIERS

SLOS182A – FEBRUARY 1997 – REVISED MARCH 2000

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

TLE2084Y chip information

This chip, when properly assembled, displays characteristics similar to the TLE2084. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (11) IS INTERNALLY CONNECTED

TO BACKSIDE OF THE CHIP.

–

1OUT

1IN +

1IN –

VCC+

(11)

(6)

(3)

(2)

(5)

(1)

(7)

(4)

–

2OUT

2IN +

2IN –

VCC –

–

3OUT

3IN +

3IN –

(13)

(10)

(9)

(12)

(8)

(14)

–

4OUT

4IN +

4IN –

(2)

(1)

(14)

(4)

(5)

(6)

(7)

(8)

(9)

(10)

(11)

(12)

(13)

100

150

(3)

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