TL1431

PRECISION PROGRAMMABLE REFERENCE

SLVS062F – DECEMBER 1991 – REVISED JANUARY 2000

2

POST OFFICE BOX 655303

AVAILABLE OPTIONS

PACKAGED DEVICES

TA

SMALL

OUTLINE

(D)

PLASTIC

FLANGE

MOUNTED

(KTP)

TO-226AA

(LP)

CHIP

CARRIER

(FK)

CERAMIC

DIP

(JG)

CHIP

FORM

(Y)

0

°C to 70°C

TL1431CD

TL1431CKTPR

TL1431CLP

–

–

–40

°C to 125°C

TL1431QD

–

TL1431QLP

–

–

TL1431Y

–55

°C to 125°C

–

–

–

TL1431MFK

TL1431MJG

The D and LP packages are available taped and reeled. The KTP package is only available taped and reeled. Add the suffix R

to the device type (e.g., TL1431CDR). Chip forms are tested at 25

°C.

logic symbol

REF

ANODE

CATHODE

functional block diagram

+

–

CATHODE

ANODE

REF

Vref