THS8133, THS8133A, THS8133B

TRIPLE 10-BIT, 80 MSPS VIDEO D/A CONVERTER

WITH TRI-LEVEL SYNC GENERATION

SLVS204C – APRIL 1999 – REVISED SEPTEMBER 2000

21

POST OFFICE BOX 655303

MECHANICAL DATA

PHP (S-PQFP-G48)

PowerPAD

™ PLASTIC QUAD FLATPACK

Thermal Pad

(see Note D)

Gage Plane

0,13 NOM

0,25

0,45

0,75

Seating Plane

4146927/A 01/98

0,17

0,27

24

25

13

12

SQ

36

37

7,20

6,80

48

1

5,50 TYP

SQ

8,80

9,20

1,05

0,95

1,20 MAX

0,50

M

0,08

0,08

0

°–7°

0,05

0,15

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusions.

D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically

and thermally connected to the backside of the die and possibly selected leads.

E. Falls within JEDEC MO-153

PowerPAD is a trademark of Texas Instruments.