SUPERWORLD ELECTRONICS (S) PTE LTD

SCI0805LP SERIES

NOTE : Specifications subject to change without notice. Please check our website for latest information.

PG. 5

15.01.2008

WIREWOUND CHIP INDUCTORS

MIL-STD202F, METHOD 215D

6

Resistance to

solvent test

There shall be no case of

deformation change in

appearance of obliteration

of marking

Amplitude : 1.5mm

Oscillation Frequency : 10 to 55 to 10Hz for 1 min.

Test device shall be soldered on the substrate

Time : 2hrs for each axis (X, Y, Z), total 6hrs.

Pre-heating : 150°C, 1 min

Solder Composition : Sn/Pb=63/67

Solder Temperature : 230±5°C

Immersion Time : 20±2sec

Solder Temperature : 260±5°C

Immersion Time : 5±2sec

The device should be REFLOW soldered (230±5°C for

10 seconds) to a tinned copper subs rate. A dynamiter

force gauge should be applied to the side of the

conponent. The device must withstand a minimum force

of 2 or 4 pounds without a failure of the termination

attached to component.

Pre-heating : 150°C, 1min

Solder Composition : Sn/Pb=63/67

Solder Temperature : 230±5°C

Immersion Time : 4±1sec

Drop 1 time for each face and 1 time for each corner.

Total drop 10 times.

Drop Height : 100cm

Drop Weight : 125g

after fluxing (alpha 100 or equiv), inductor shall be

dipped in a melted solder bath at 232±5°C for 5 seconds.

Drop Test

4

5

Solderability Test

3

Adhesion

(Push Test)

Component

After test, the chip inductor

don't fell of broke on the

The terminal should at least

be 90% covered with solder

P.C.Board

The electrodes shall be at

least 90% covered with new

solder coating.

3

Component

Adhesion

(Push Test)

2

1

Resistance to

Soldering Heat

Vibration

Q change : within ±10%

1 lbs. For 0402

2 lbs. For 0603

3 lbs. For the rest

Appearance : No damage

Appearance : No damage

L change : within ±5%

Q change : within ±10%

L change : within ±5%

Mechanical Performance Test :

TEST CONDITIONS / TEST METHODS

SPECIFICATION

ITEM