13

LT1638/LT1639

16389fd

MSOP (MS8) 0204

0.53

± 0.152

(.021

± .006)

SEATING

PLANE

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.18

(.007)

0.254

(.010)

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

TYP

0.127

± 0.076

(.005

± .003)

0.86

(.034)

REF

0.65

(.0256)

BSC

0

° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

12

3

4

4.90

± 0.152

(.193

± .006)

8

7 6 5

3.00

± 0.102

(.118

± .004)

(NOTE 3)

3.00

± 0.102

(.118

± .004)

(NOTE 4)

0.52

(.0205)

REF

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889

± 0.127

(.035

± .005)

RECOMMENDED SOLDER PAD LAYOUT

0.42

± 0.038

(.0165

± .0015)

TYP

0.65

(.0256)

BSC

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660)

3.00

±0.10

(4 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON TOP AND BOTTOM OF PACKAGE

0.38

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65

± 0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

2.38

±0.10

(2 SIDES)

1

4

8

5

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

0.00 – 0.05

(DD) DFN 1203

0.25

± 0.05

2.38

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65

±0.05

(2 SIDES)

2.15

±0.05

0.50

BSC

0.675

±0.05

3.5

±0.05

PACKAGE

OUTLINE

0.25

± 0.05

0.50 BSC

DD Package

8-Lead Plastic DFN (3mm

× 3mm)

(Reference LTC DWG # 05-08-1698)