TDA2003H datasheet(8/10 Pages) STMICROELECTRONICS

8 / 10 page

Component

Recommmended

value

Purpose

Larger than

recommended value

Smaller than

recommended value C1

2.2

µF

Input DC

decoupling

Noise at switch-on,

switch-off

470

µF

Ripple rejection

Degradation of SVR

0.1

µF

Supply bypassing

Danger of oscillation

1000

µF

Output coupling to load

Higher low frequency

cutoff

0.1

µF

Frequency stability

Danger of oscillation at

high frequencies with

inductive loads

≅

π BR1

Upper frequency cutoff

Lower bandwidth

Larger bandwidth

(Gv-1)

• R2

Setting of gain

Increase of drain current

2.2

Ω

Setting of gain

and SVR

Degradation of SVR

Ω

Frequency stability

Danger of oscillation at

high frequencies with

inductive loads

≅ 20 R2

Upper frequency cutoff

Poor high frequency

attenuation

Danger of oscillation

PRATICAL CONSIDERATION

Printed circuit board

The layout shown in fig. 17 is recommended. If

different layouts are used, the ground points of

input 1 and input 2 must be well decoupled from

the ground of the output through which a ratherhigh

current flows.

Assembly suggestion

No electrical insulation is required between the

package and the heat-sink.Pin length should be as

short as possible. The soldering temperature must

not exceed 260

°C for 12 seconds.

Application suggestions

The recommended component values are those

shown in the application circuits of fig.16.

Different values can be used. The following table is

intended to aid the car-radio designer.

8/10

TDA2003

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