STV7617, STV7617D, STV7617U

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ABSOLUTE MAXIMUM RATINGS

THERMAL DATA

Note 1 For TQF P100 packaging and slug soldered on printed circuit board.

Note 2 Through one power output.

Note 3 Through all power outputs (see test diagram): with Power dissipation lower or equal than Ptot and Junction tem-

perature lower or

Note 4 These parameters are measured during ST’s internal qualification which includes temperature characterisation

on standard

batches and on corners batches of the process. These parameters are not tested on the parts.

Note 5 TQFP soldered on 4 layers Printed Circuit Board.

Symbol

Parameter

Value

Unit

Logic Supply (Pin 88)*

-0.3, +7

V

OUTi

Output Pins (1 to 28, 36 to 40, 48 to 77, 99, 100)

-0.3, +100

V

Logic Input Voltage (Pins 84, 86, 87, 89, 90, 91, 92)*

V

V

OUT

V

Driver Output Voltage (scanning mode)

-0.3, +100

V

Driver Output Current (1) (4)

-100, +1 A

mA

Diode Output Current (3) (4)

±700

mA

Junction Temperature

+150

°C

T

oper

Operating Temperature

-20, +85

°C

Storage Temperature

-20, +150

°C

Symbol

Parameter

Value

Unit

Junction-ambient Thermal Resistance (1)

20

°C/W

Maximum Operating Junction (1)

125

°C

Junction-ambient Thermal Resistance (5)

40

°C/W

3