STTH110 datasheet(3/5 Pages) STMICROELECTRONICS

3 / 5 page

STTH110/A

3/5

P(W)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

(A)

F(AV)

δ = 1

δ = 0.05

δ = 0.5

δ = 0.2

δ = 0.1

δ=tp/T

Fig. 1: Conduction losses versus average current.

(A)

0.1

1.0

10.0

100.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

(V)

T =25°C

(maximum values)

T =150°C

(maximum values)

T =150°C

(typical values)

Fig. 2: Forward voltage drop versus forward

current

Z/R

th(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

t (s)

δ=tp/T

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

Fig. 3-1: Relative variation of thermal impedance

junction ambient versus pulse duration (epoxy

FR4, Lleads = 10mm) (DO-41).

Z/R

th(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

t (s)

δ=tp/T

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

Fig. 3-2: Relative variation of thermal impedance

junction ambient versus pulse duration (epoxy

FR4) (SMA).

(°C/W)

th(j-a)

100

110

120

012

34567

S(cm²)

Fig. 4-1: Thermal resistance junction to ambient

versus copper surface under each lead (epoxy

printed circuit board FR4, copper thickness: 35µm)

(DO-41).

(°C/W)

th(j-a)

100

110

120

130

140

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S(cm²)

Fig. 4-2: Thermal resistance junction to ambient

versus copper surface under each lead (epoxy

printed circuit board FR4, copper thickness: 35µm)

(SMA).

STTH110 Folha de dados(PDF) 3 Page - STMicroelectronics

STTH110 Folha de dados(HTML) 3 Page - STMicroelectronics

Html Pages

1 2 3 4 5

Folha de dados Download

Ligação URL