STPS5H100

4/5

Figure 11: DPAK Package Mechanical Data

Figure 12: Foot Print Dimensions (in millimeters)

H

L4

G

B

L2

E

B2

D

A1

R

R

C

A

C2

0.60 MIN.

V2

A2

6.7

6.7

3

3

1.6

1.6

2.3

2.3

REF.

DIMENSIONS

Millimeters

Inches

Min.

Max

Min.

Max.

A

2.20

2.40

0.086

0.094

A1

0.90

1.10

0.035

0.043

A2

0.03

0.23

0.001

0.009

B

0.64

0.90

0.025

0.035

B2

5.20

5.40

0.204

0.212

C

0.45

0.60

0.017

0.023

C2

0.48

0.60

0.018

0.023

D

6.00

6.20

0.236

0.244

E

6.40

6.60

0.251

0.259

G

4.40

4.60

0.173

0.181

H

9.35

10.10

0.368

0.397

L2

0.80 typ.

0.031 typ.

L4

0.60

1.00

0.023

0.039

V2

0°

8°

0°

8°

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These

packages have a Lead-free second level interconnect . The category of second level interconnect is

marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The

maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an

ST trademark. ECOPACK specifications are available at: www.st.com.