Package mechanical data

STLM20

12/16

7

Package mechanical data

packages. These packages have a lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 5.

SOT323-5 – 5-lead small outline transistor package outline

1.

Drawing is not to scale.

Table 8.

SOT323-5 – 5-lead small outline transistor package mechanical data

Symbol

mm

inches

Typ

Min

Max

Typ

Min

Max

A

–

0.80

1.10

–

0.031

0.043

A1

–

0

0.10

–

0

0.004

A2

0.90

–

–

0.035

–

–

b

–

0.15

0.30

–

0.006

0.012

C

–

0.10

0.20

–

0.004

0.008

D

2.00

1.90

2.10

0.079

0.075

0.083

E

–

1.80

2.40

–

0.071

0.094

E1

1.25

1.15

1.35

0.049

0.045

0.053

e0.65–

–

0.026

–

–

e1

1.30

–

–

0.051

–

–

L0.52–

–

0.020

–

–

L1

0.40

0.35

0.45

0.016

0.014

0.018

s–

0°

5°

–

0°

5°

SOT323-5

0.10 C

A

A2

A1

5X

C

e1

D

e

5X b

E

B

E1

A

M

0.10

C A

B

s

s

1

C

L1

s

L

C