Package information

TDA7348

18/20

5

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 6.

SO-28 mechanical, data and package dimensions

SO-28

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

2.65

0.104

a1

0.1

0.3

0.004

0.012

b

0.35

0.49

0.014

0.019

b1

0.23

0.32

0.009

0.013

C

0.5

0.020

c1

45

° (typ.)

D

17.7

18.1

0.697

0.713

E

10

10.65

0.394

0.419

e

1.27

0.050

e3

16.51

0.65

F

7.4

7.6

0.291

0.299

L

0.4

1.27

0.016

0.050

S8

° (max.)

OUTLINE AND

MECHANICAL DATA