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LRIS2K Folha de dados(PDF) 92 Page - STMicroelectronics |
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LRIS2K Folha de dados(HTML) 92 Page - STMicroelectronics |
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92 / 102 page ![]() Package mechanical data LRIS2K 92/102 47 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second-level interconnect. The category of Second-Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 61. A1 antenna on tape outline 1. Drawing is not to scale. Table 95. A1 antenna on tape, mechanical data Symbol Parameter Typ Min Max Unit A1 Coil width 45 44.5 45.5 mm A2 Coil length 76 75.5 76.5 mm B1 Antenna cut width 49 48.8 49.2 mm B2 Antenna cut length 82 81.8 82.2 mm C1 Die position from antenna 23 22.8 23.2 mm C2 Die position from antenna 56 55.8 56.2 mm Silicon thickness 180 165 195 µm Q Unloaded Q value 35 FNOM Unloaded free-air resonance 15.1 MHz PA H-field energy for device operation 0.03 90 A/m dbµA/m A1 B1 A2 B2 C2 C1 ai10119 |
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