HCF4093

Package mechanical data

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Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

Figure 5.

Plastic DIP-14 package outline

1.

Drawing not to scale.

Table 8.

Plastic DIP-14 mechanical data

Symbol

millimeters

inches

Min

Typ

Max

Min

Typ

Max

a1

0.51

0.020

B

1.39

1.65

0.055

0.065

b0.5

0.020

b1

0.25

0.010

D20

0.787

E8.5

0.335

e

2.54

0.100

e3

15.24

0.600

F

7.1

0.280

I

5.1

0.201

L3.3

0.130

Z

1.27

2.54

0.050

0.100

P001A