LT3083IDF datasheet(23/28 Pages) AD

23 / 28 page

LT3083

Rev. B

For more information www.analog.com

PACKAGE DESCRIPTION

FE16 (BB) TSSOP REV L 1216

0.09 – 0.20

(.0035 – .0079)

° – 8°

0.25

REF

0.50 – 0.75

(.020 – .030)

4.30 – 4.50*

(.169 – .177)

3 4 5 6 7 8

10 9

4.90 – 5.10*

(.193 – .201)

16 1514 13 12 11

1.10

(.0433)

MAX

0.05 – 0.15

(.002 – .006)

0.65

(.0256)

BSC

2.94 ±0.15

(.116 ±.006)

0.195 – 0.30

(.0077 – .0118)

TYP

RECOMMENDED SOLDER PAD LAYOUT

0.45

±0.05

0.65 BSC

4.50

±0.10

6.60

±0.10

1.05

±0.10

2.94

(.116)

3.05

(.120)

3.70 ±0.15

(.146 ±.006)

3.70

(.146)

4.70

(.185)

MILLIMETERS

(INCHES)

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

SEE NOTE 4

NOTE 5

6.40 ±0.15

(.252 ±.006)

FE Package

16-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1663 Rev L)

Exposed Pad Variation BB

5. BOTTOM EXPOSED PADDLE MAY HAVE METAL PROTRUSION

IN THIS AREA. THIS REGION MUST BE FREE OF ANY EXPOSED

TRACES OR VIAS ON PCB LAYOUT

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

DETAIL A

DETAIL A IS THE PART OF THE

LEAD FRAME FEATURE FOR

REFERENCE ONLY

NO MEASUREMENT PURPOSE

0.56

(.022)

REF

0.53

(.021)

REF

DETAIL A

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