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For price, delivery, and to place orders: Analog Devices, Inc., One Analog Way, Wilmington, MA 01887

Phone: 781-937-1428 • Order online at www.analog.com

Application Support: Phone: 1-800-ANALOG-D

Outline Drawing

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking [1]

HMC981LP3E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

H981

XXXX

[1] 4-Digit lot number XXXX

[2] Max peak reflow temperature of 260 °C

Package Information

Absolute Maximum Ratings [1]

VDD

12V

VG2_CONT, VDRAIN

-0.5V to VDD + 0.5V

SW, EN, CP_OUT, VGATEFB,

VNEGFB, TRIG_OUT, DISBL_SC,

ISENSE

-0.5V to VDIG + 0.5V

VDIG

5.5V

VNEG

-4V to GND

VG2

-0.5V to VDD + 0.5V

Junction Temperature

125 °C

Continuous Pdiss (T = 85 °C)

(Derate 19.19 mW/°C above 85 °C)

0.77 Watts

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Thermal Resistance (R

TH)

(Junction to package bottom)

52.1 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

ESD Sensitivity (HBM)

Class 1B

Note that there are two different voltage domains on

HMC981LP3E; a high voltage domain Vdd, and a low voltage

domain VDIG. Take necessary precautions not to violate ABS

MAX ratings of each subdomains.

HMC981LP3E

v02.1222

ACTIVE BIAS CONTROLLER

NOTES:

1.

PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND

SILICON IMPREGNATED.

2.

LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.

3.

LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.

4.

DIMENSIONS ARE IN INCHES [MILLIMETERS].

5.

LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

6.

CHARACTERS TO BE HELVETICA MEDIUM, .025 HIGH, WHITE INK, OR LASER MARK

LOCATED APPROX. AS SHOWN.

7.

PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.05mm MAX.

8.

PACKAGE WARP SHALL NOT EXCEED 0.05mm

9.

ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.

10.

REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.