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ADG774ABCPZ-R2 Folha de dados(PDF) 13 Page - Analog Devices

Nome de Peças ADG774ABCPZ-R2
Descrição Electrónicos  Low Voltage, 400 MHz, Quad 2:1 Mux with 3 ns Switching Time
PDF  14 Pages
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Fabricante Electrônico  AD [Analog Devices]
Página de início  http://www.analog.com
Logo AD - Analog Devices

ADG774ABCPZ-R2 Folha de dados(HTML) 13 Page - Analog Devices

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Data Sheet
ADG774A
Rev. C | Page 13 of 14
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-137-AB
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
16
9
8
1
SEATING
PLANE
0.010 (0.25)
0.004 (0.10)
0.012 (0.30)
0.008 (0.20)
0.025 (0.64)
BSC
0.041 (1.04)
REF
0.010 (0.25)
0.006 (0.15)
0.050 (1.27)
0.016 (0.41)
0.020 (0.51)
0.010 (0.25)
8°
0°
COPLANARITY
0.004 (0.10)
0.065 (1.65)
0.049 (1.25)
0.069 (1.75)
0.053 (1.35)
0.197 (5.00)
0.193 (4.90)
0.189 (4.80)
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
Figure 29. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in inches and (millimeters)
3.10
3.00 SQ
2.90
0.30
0.25
0.20
1.65
1.50 SQ
1.45
1
0.50
BSC
BOTTOM VIEW
TOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
PIN 1
INDICATOR
0.50
0.40
0.30
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.80
0.75
0.70
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-16-27)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
ADG774ABRQ-REEL7
−40°C to +85°C
16-Lead Shrink Small Outline Package [QSOP]
RQ-16
ADG774ABRQZ
−40°C to +85°C
16-Lead Shrink Small Outline Package [QSOP]
RQ-16
ADG774ABRQZ-REEL
−40°C to +85°C
16-Lead Shrink Small Outline Package [QSOP]
RQ-16
ADG774ABRQZ-REEL7
−40°C to +85°C
16-Lead Shrink Small Outline Package [QSOP]
RQ-16
ADG774ABCPZ-REEL
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP]
CP-16-27
ADG774ABCPZ-R2
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP]
CP-16-27
1 Z = RoHS Compliant Part.



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