L8229 datasheet(40/42 Pages) STMICROELECTRONICS

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Package Information

L8229

40/42

Package Information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 10.

PowerSSO24 Mechanical Data & Package Dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

2.15

2.47

0.084

0.097

2.15

2.40

0.084

0.094

0.075

0.003

0.33

0.51

0.013

0.020

0.23

0.32

0.009

0.012

D (1)

10.10

10.50

0.398

0.413

E (1)

7.4

7.6

0.291

0.299

0.8

0.031

8.8

0.346

0.10

0.004

0.06

0.002

10.10

10.50

0.398

0.413

0.40

0.016

0.55

0.85

0.022

0.033

10˚ (max)

4.10

4.70

0.161

0.185

6.50

7.10

0.256

0.279

(1) “D and E1” do not include mold flash or protusions.

Mold flash or protusions shall not exceed 0.15mm (0.006”)

(2) No intrusion allowed inwards the leads.

(3) Flash or bleeds on exposed die pad shall not exceed 0.4 mm

per side

PowerSSO -24

7412818 A

(Exposed Pad)

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