LS E63B

DATASHEET

DATASHEET

13 | Version 1.3 | 2022-09-21

Recommended Solder Pad 8)

OHLPY440

Padgeometrie für

verbesserte Wärmeableitung

improved heat dissipation

Paddesign for

Lötstoplack

Solder resist

0.8 (0.031)

2.3 (0.091)

3.3 (0.130)

Cu Fläche /16 mm per pad

2

Cu-area

_

<

3.3 (0.130)

Kathode/

Cathode

Anode

0.7 (0.028)

Fläche darf bei Verwendung von TOPLED®

For TOPLED® assembly do not use

elektrisch nicht beschaltet werden.

this area for electrical contact

Fläche darf bei Verwendung von TOPLED®

For TOPLED® assembly do not use

elektrisch nicht beschaltet werden.

this area for electrical contact

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not

suitable for any kind of wet cleaning or ultrasonic cleaning.