LS-B6SP datasheet(1/22 Pages) AMSOSRAM

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LS B6SP

1 Version 1.5 | 2020-06-29

Produktdatenblatt | Version 1.1

www.osram-os.com

Applications

LS B6SP

Power SIDELED®

Power SIDELED features a compact package with a

wide brightness range and high luminous efficiency.

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Cluster, Button Backlighting

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Signalling

Features:

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Package: white PLCC-2 package, clear silicone resin

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Chip technology: Thinfilm

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Typ. Radiation: 120° (Lambertian emitter)

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Color: λ

dom = 630.0 nm (● super red)

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Corrosion Robustness Class: 3B

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Qualifications: AEC-Q102 Qualified

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ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

Nº de peça semelhante - LS-B6SP

Fabricante Electrônico	Nome de Peças	Folha de dados	Descrição Electrónicos
OSRAM GmbH	LS-B6SP	675Kb / 21P	white PLCC-2 package, clear silicone resin

Fabricante Electrônico	Nome de Peças	Folha de dados	Descrição Electrónicos
OSRAM GmbH	LYB6SP	675Kb / 21P	Power SIDELED
	LTA673	588Kb / 21P	SIDELED
	LTA67C	582Kb / 21P	SIDELED
	SFH-325	401Kb / 15P	SIDELED
ams AG	SFH4256	897Kb / 16P	SIDELED® High Power Infrared Emitter (850 nm) Version 1.5 2020-08-26
	LOA67B	1Mb / 23P	SIDELED® Version 1.2 2019-07-16
	LOA67F	1Mb / 23P	SIDELED® Ambient Lighting Version 1.9 2022-09-01
	LOA67K	1Mb / 23P	SIDELED® Ambient Lighting Version 1.6 2022-09-01
	LGA676	1Mb / 21P	SIDELED® Version 1.3 2019-07-16
	LGA67K	1Mb / 24P	SIDELED® Version 1.5 2022-08-04