Ordering information

EMIF02-USB05F2

6/7

Note:

More packing information is available in the application notes

AN1235: “Flip-Chip: Package description and recommendations for use”

AN1751: “EMI Filters: Recommendations and measurements”

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

4

Ordering information

5

Revision history

Ordering code

Marking

Package

Weight

Base qty

Delivery mode

EMIF02-USB05F2

GV

Flip-Chip

2.7 mg

5000

Tape and reel 7”

Date

Revision

Changes

14-Mar-2005

1

Initial release.

13-Nov-2006

2

Reformatted to current standards. Modified functional diagram on

page 1 to show connections. Updated Aplac model information.