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TS971 Folha de dados(PDF) 14 Page - STMicroelectronics |
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TS971 Folha de dados(HTML) 14 Page - STMicroelectronics |
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14 / 17 page ![]() Package information TS971-TS972-TS974 14/17 3.8 DFN8 exposed pad package information Figure 20. DFN8 3x3 exposed pad package mechanical drawing Table 11. DFN8 3x3 exposed pad package mechanical data Ref. Dimensions Millimeters Mils Min. Typ. Max. Min. Typ. Max. A 0.80 0.90 1.00 31.5 35.4 39.4 A1 0.02 0.05 0.8 2.0 A2 0.70 25.6 A3 0.20 7.9 b 0.18 0.23 0.30 7.1 9.1 11.8 D 2.875 3.00 3.125 118.1 D2 2.23 2. 2.48 87.8 90.7 97.7 E 2.875 3.00 3.125 118.1 E2 1.49 1.64 1.74 58.7 64.6 68.5 e 0.65 25.6 L 0.30 0.40 0.50 11.8 15.7 19.7 |
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