Functions, pins and components description

TDA7571

18/21

4.9

Components with critical placement and type

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Ci-L1, Ci-L2, Ci-R1, Ci-R2 must be placed as near as possible to the sources of the

respective power MOS. If 2 power MOS in parallel are needed, can be useful to place a

couple of capacitors for each couple of power MOS. These capacitors are needed to

absorb the high di/dt current present during the Pchannel/Nchannel and

Nchannel/Pchannel transition that can cause high peak voltages on the power supply

wiring connection due to their parasitic inductance.

●

The capacitors placed between +Vs to GND and to -Vs are distributed along the power

lines. With P.C. board with very short connections, some of these capacitors can be

avoided (Cvs-1, Cvs-2, Cd3, Cd4, Cd8, Cd7).

●

The current sensing resistors Rsens-N-L, Rsens-P-L, Rsens-P-R and Rsens-N-R must

be not inductive components, as example, made by a constant an wire.