RZSLASHT2ME datasheet(104/116 Pages) RENESAS

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2.5.5.15

Serial Management Interface Timing

Conditions:

VOH = VCC18 × 0.5, VOL = VCC18 × 0.5, C = 30 pF (1.8 V)

VOH = VCC33 × 0.5, VOL = VCC33 × 0.5, C = 30 pF (3.3 V)

Table 2.40

Serial management interface timing

Parameter

Symbol

Min.

Max.

Unit

Reference figure

MDIO

MDC output cycle time

GMAC_MDC,

ETHSW_MDC

TMDCck

—

Figure 2.88

ESC_MDC

400

—

MDIO output delay time (for MDC fall)*1

TMDIOd

—

MDIO input setup time (for MDC

rise)

GMAC_MDC,

ETHSW_MDC

TMDIOs

—

ESC_MDC

—

MDIO input hold time (for MDC rise)

TMDIOh

—

Note 1. The output timing from ETHSW is based on the rising edge of MDC, and the output delay can be set in the register.

tMDCck

GMAC_MDC

ETHSW_MDC

ESC_MDC

(Output)

tMDIOs

tMDIOh

tMDIOd

GMAC_MDIO

ETHSW_MDIO

ESC_MDIO

(Input)

GMAC_MDIO

ETHSW_MDIO

ESC_MDIO

(Output)

Figure 2.88

Serial management interface timing

2.6

USB Characteristics

Table 2.41

On-chip USB low-speed (host only) characteristics

Parameter

Symbol

Min.

Typ.

Max.

Unit

Reference figure

Rising time

tLR

—

300

Figure 2.89, Figure 2.90

Falling time

tLF

—

300

Rising/falling time ratio

tLR/tLF

—

125

RZ/T2ME Datasheet

2. Electrical Characteristics

R01DS0441EJ0110 Rev.1.10

Mar 13, 2026

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