CMV2000 datasheet(83/87 Pages) AMSOSRAM

Nome de Peças	CMV2000

Descrição Electrónicos	CMV2000 Global shutter CMOS image sensor for machine vision

PDF	87 Pages

Scroll/Zoom	100%

Fabricante Electrônico	AMSOSRAM [ams-OSRAM AG]

Página de início	https://ams-osram.com/

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83 / 87 page

CMV2000

Soldering & storage information

Datasheet

• PUBLIC • Document Feedback

DS000734

• v8-00 • 2025-Jul-07

83 / 87

Soldering & storage information

CMV2000 is shipped in a moisture barrier package. We recommend to keep the moisture

barrier package closed and stored under the conditions shown in Table 5. Only open the

moisture barrier package before the usage of the devices.

When reflow soldering, a dry bake needs to be performed upfront! For soldering information,

follow Standard J-STD-020. If the temperature/time profile exceeds these recommendations,

damage to the image sensor can occur.

11.1

Manual soldering

Use partial heating method and use a soldering iron with temperature control. The soldering

iron tip temperature is not to exceed 350 ºC with 270 °C maximum pin temperature, 2 seconds

maximum duration per pin. Avoid global heating of the ceramic package during soldering.

Failure to do so may alter device performance and reliability.

11.2

Wave soldering

Wave soldering is possible but not recommended. Solder dipping can cause damage to the

glass and harm the imaging capability of the device. See Figure 63 for the wave soldering

profile.

CMV2000 Folha de dados(PDF) 83 Page - ams-OSRAM AG