| Os motores de busca de Datasheet de Componentes eletrônicos |
|
AS1163 Folha de dados(PDF) 11 Page - ams-OSRAM AG |
|
|
|||||||||||||||||||||||||||||
AS1163 Folha de dados(HTML) 11 Page - ams-OSRAM AG |
|
11 / 91 page ![]() AS1163 Pin assignment Datasheet • PUBLIC • Document Feedback DS001075 • v2-00 • 2025-Nov-21 11 / 91 / 3 Pin assignment 3.1 Pin diagram Figure 6: Block diagram and pinout (package bottom view) (1) The heat pad on bottom side is connected to the device substrate. It is recommended to connect the heat pad to GND or leave it floating, do not connect to any other signal. 13 16 14 15 8 5 7 6 |
|
Ligação URL |
| ALLDATASHEET é útil para você? [ DONATE ] |
Sobre Alldatasheet | Publicidade | Contato conosco | Privacy Policy | Link para a ficha técnica | roca de Link | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |