AS7262 datasheet(39/48 Pages) AMSOSRAM

Nome de Peças	AS7262

Descrição Electrónicos	6-Channel Visible Spectral_ID Device with Electronic Shutter and Smart Interface

PDF	48 Pages

Scroll/Zoom	100%

Fabricante Electrônico	AMSOSRAM [ams-OSRAM AG]

Página de início	https://ams-osram.com/

Logo

39 / 48 page

Page 38

Datasheet, Public

Document Feedback

[v4-00] 2022-Nov-30

AS7262 − Soldering & Storage Information

Soldering Information

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate. The solder reflow

profile describes the expected maximum heat exposure of

components during the solder reflow process of product on a

PCB. Temperature is measured on top of component. The

components should be limited to a maximum of three passes

through this solder reflow profile.

Figure 37:

Solder Reflow Profile

Figure 38:

Solder Reflow Profile Graph

Parameter

Reference

Device

Average temperature gradient in preheating

2.5

°C/s

Soak time

tSOAK

2 to 3 minutes

Time above 217

°C(T

1)t1

Max 60s

Time above 230

°C(T

2)t2

Max 50s

Time above Tpeak - 10°C(T3)t3

Max 10s

Peak temperature in reflow

Tpeak

260

°C

Temperature gradient in cooling

Max -5

°C/s

Soldering & Storage

Information

AS7262 Folha de dados(PDF) 39 Page - ams-OSRAM AG

AS7262 Folha de dados(HTML) 39 Page - ams-OSRAM AG

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

Folha de dados Download

Ligação URL