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STP16DP05MTR Folha de dados(PDF) 21 Page - STMicroelectronics |
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STP16DP05MTR Folha de dados(HTML) 21 Page - STMicroelectronics |
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21 / 29 page ![]() STP16DP05 Package mechanical data 21/29 8 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com Table 14. QSOP-24 mechanical data Dim. mm. inch Min Typ Max Min Typ Max A 1.54 1.62 1.73 0.061 0.064 0.068 A1 0.1 0.15 0.25 0.004 0.006 0.010 A2 1.47 0.058 b 0.31 0.2 0.012 0.008 c 0.254 0.17 0.010 0.007 D 8.56 8.66 8.76 0.337 0.341 0.345 E 5.8 6 6.2 0.228 0.236 0.244 E1 3.8 3.91 4.01 0.150 0.154 0.158 e 0.635 0.025 L 0.4 0.635 0.89 0.016 0.025 0.035 h 0.25 0.33 0.41 0.010 0.013 0.016 < 8° 0° |
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