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L5961PD Folha de dados(PDF) 4 Page - STMicroelectronics

Nome de Peças L5961PD
Descrição Electrónicos  MOST power management device (PMD)
PDF  7 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

L5961PD Folha de dados(HTML) 4 Page - STMicroelectronics

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Package information
L5961
4/7
3
Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 2.
PowerSSO-36 mechanical data and package dimensions
OUTLINE AND
MECHANICAL DATA
DIM.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
2.15
2.47
0.084
0.097
A2
2.15
2.40
0.084
0.094
a1
0
0.075
0
0.003
b
0.18
0.36
0.007
0.014
c
0.23
0.32
0.009
0.012
D (1)
10.10
10.50
0.398
0.413
E (1)
7.4
7.6
0.291
0.299
e
0.5
0.019
e3
8.5
0.335
F
2.3
0.090
G
0.10
0.004
G1
0.06
0.002
H
10.10
10.50
0.398
0.413
h
0.40
0.016
k5˚
5˚
L
0.55
0.90
0.022
0.035
M
4.3
0.169
N
10˚
10˚
O
1.2
0.047
Q
0.8
0.031
S
2.9
0.114
T3.65
0.144
U
1.0
0.039
X
4.1
4.7
0.161
0.185
Y
6.5
7.3
0.256
0.287
(1) "D” and “E" do not include mold flash or protrusions Mold flash
or protrusions shall not exceed 0.15 mm per side(0.006”)
PowerSSO-36
7587131 A
(exposed pad)
G
LEAD COPLANARITY
BOTTOM VIEW
D
e3
0.1
A
M
B
b
e
A
Y
T
L
hx45
U
O
B



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