RCL e3

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Revision: 20-Oct-2025

8

Document Number: 20046

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DIMENSIONS

SOLDER PAD DIMENSIONS

Notes

• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g in standards IEC 61188-5-x (1) or

in publication IPC-7351.

Still, the given solder pad dimensions will be found adequate for most general applications

(1) The quoted IEC standards are also released as EN standards with the same number and identical contents

DIMENSIONS AND MASS

TYPE / SIZE

L

(mm)

W

(mm)

H

(mm)

T1

(mm)

T2

(mm)

MASS

(mg)

RCL0406 e3

1.0 ± 0.10

1.6 ± 0.10

0.35 ± 0.10

0.2 +0.10 / -0.15

0.2 ± 0.10

2

RCL0612 e3

1.6 ± 0.20

3.2 ± 0.20

0.55 ± 0.10

0.35 ± 0.15

0.25 ± 0.15

11

RCL1020 e3

2.5 ± 0.20

5.0 ± 0.20

0.55 ± 0.10

0.38 ± 0.15

0.25 ± 0.15

25.5

RCL1218 e3

3.2 +0.10 / -0.20

4.6 ± 0.15

0.55 ± 0.05

0.45 ± 0.20

0.4 ± 0.20

29.5

RCL1225 e3

3.2 ± 0.20

6.3 ± 0.20

0.70 ± 0.10

0.8 ± 0.20

0.4 ± 0.20

55

RECOMMENDED SOLDER PAD DIMENSIONS

TYPE / SIZE

WAVE SOLDERING

REFLOW SOLDERING

G

(mm)

Y

(mm)

X

(mm)

Z

(mm)

G

(mm)

Y

(mm)

X

(mm)

Z

(mm)

RCL0406 e3

0.30

0.80

1.95

1.90

0.35

0.60

1.75

1.55

RCL0612 e3

0.50

1.20

3.70

2.90

0.60

1.00

3.50

2.60

RCL1020 e3

1.30

1.25

5.50

3.80

1.30

1.10

5.25

3.50

RCL1218 e3

1.80

1.30

5.10

4.40

1.90

1.10

4.90

4.10

RCL1225 e3

1.10

1.80

6.80

4.70

1.20

1.60

6.60

4.40

W

H

L

T1

T2

G

X

Y

Z