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ST7L09 Folha de dados(PDF) 94 Page - STMicroelectronics

Nome de Peças ST7L09
Descrição Electrónicos  8-bit MCU for automotive with single voltage Flash memory, data EEPROM, ADC, timers, SPI
PDF  104 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST7L09 Folha de dados(HTML) 94 Page - STMicroelectronics

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14 PACKAGE CHARACTERISTICS
In order to meet environmental requirements, ST
offers these devices in ECOPACK® packages.
These packages have a lead-free second level in-
terconnect. The category of second Level Inter-
connect is marked on the package and on the in-
ner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to solder-
ing conditions are also marked on the inner box la-
bel.
ECOPACK is an ST trademark. ECOPACK speci-
fications are available at www.st.com.
14.1 PACKAGE MECHANICAL DATA
Figure 72. 16-Pin Plastic Small Outline Package, 150-mil Width
14.2 THERMAL CHARACTERISTICS
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.
The power dissipation of an application can be defined by the user with the formula: PD =PINT +PPORT where PINT is the
chip internal power (IDD xVDD) and PPORT is the port power dissipation depending on the ports used in the application.
Symbol
Ratings
Value
Unit
RthJA
Package thermal resistance (junction to ambient)
95
°C/W
TJmax
Maximum junction temperature1)
150
°C
PDmax
Power dissipation2)
500
mW
Dim.
mm
inches
Min
Typ
Max
Min
Typ
Max
A
1.35
1.75 0.053
0.069
A1
0.10
0.25 0.004
0.010
B
0.33
0.51 0.013
0.020
C
0.19
0.25 0.007
0.010
D
9.80
10.00 0.386
0.394
E
3.80
4.00 0.150
0.157
e
1.27
0.050
H
5.80
6.20 0.228
0.244
α
0°
8°
0°
8°
L
0.40
1.27 0.016
0.050
Number of Pins
N
16
0016020
E
H
A1
C
α
45×
A
A1
B
D
e
16
9
1
8
L
1



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