Package and packing informations

SMA661AS

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5

Package and packing informations

5.1

Package informations

In order to meet environmental requirements, ST offers this device in ECOPACK® package.

This package has a Lead-free second level interconnect. The category of second Level

Interconnect is marked on the package and on the inner box label, in compliance with

JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also

marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 16.

SOT666 (Lead-Free) package outline

Table 6.

SOT666 (Lead-free) mechanical data

DIM.

mm.

MIN.

TYP

MAX.

A

0.45

0.60

A3

0.08

018

b

0.17

0.27

b1

0.27

0.34

D

1.50

1.70

E

1.50

1.70

E1

1.10

1.30

e0.50

L1

0.19

L2

0.10

0.30

L3

0.10

E1

E

L2

D

A

A3

b1

0.10

b

M

e

A

L1

L3

A