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STPSC4H065DI Folha de dados(PDF) 6 Page - STMicroelectronics |
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STPSC4H065DI Folha de dados(HTML) 6 Page - STMicroelectronics |
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6 / 14 page ![]() 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 TO-220AC package information • Epoxy meets UL 94,V0 • Cooling method: by conduction (C) • Recommended torque value: 0.55 N·m • Maximum torque value: 0.70 N·m Figure 11. TO-220AC package outline A C D L7 Ø I L5 L6 L9 L4 F H2 G L2 F1 E M Gate note (1)(2) (1) :Max resin gate protusion 0.5 mm (2) :Resin gate position is accepted in each of the two positions shown on the drawings or their symmetrical Gate note (1)(2) 0.10 STPSC4H065 Package information DS9222 - Rev 6 page 6/14 |
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