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DA9131 Folha de dados(PDF) 11 Page - Renesas Technology Corp |
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DA9131 Folha de dados(HTML) 11 Page - Renesas Technology Corp |
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11 / 59 page ![]() DA9131 Datasheet R16DS0576EJ0300 Rev.03.00 July 18, 2025 CFR0011-120-00 Page 11 3.4 Thermal Specifications Table 6. Package ratings Parameter Description Conditions Min Typ Max Unit θJA Package thermal resistance Note 1 21.21 °C/W θJB Thermal resistance junction to board Note 1 12.37 °C/W θJC Thermal resistance junction to case Without PCB 32 °C/W Note 1 Obtained from package thermal simulations, JEDEC 2S2P four layer board (76.2 mm x 114 mm x 1.6 mm), 70 μm (2 oz) copper thickness power planes, 35 μm (1 oz) copper thickness signal layer traces, natural convection (still air), see section 9.1. 3.4.1 Power Dissipation Table 7. Power dissipation Parameter Description Conditions Min Typ Max Unit PD_Twarn Power dissipation @105 °C ambient, TJ_WARN 0.94 W PD_Tcrit Power dissipation @105 °C ambient, TCRIT 1.18 1.65 W Figure 5. Power derating curve |
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