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25CS160-H/ST Folha de dados(PDF) 43 Page - Microchip Technology |
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25CS160-H/ST Folha de dados(HTML) 43 Page - Microchip Technology |
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43 / 53 page ![]() 2026 Microchip Technology Inc. and its subsidiaries Preliminary DS20007008B-page 43 25CS160 Microchip Technology Drawing C04-028-C8X Rev. F Sheet 2 of 2 6-Lead Plastic Small Outline Transistor (C8X) [SOT-23] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: protrusions shall not exceed 0.25mm per side. 1. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. Notes: REF: Reference Dimension, usually without tolerance, for information purposes only. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or Dimensioning and tolerancing per ASME Y14.5M Foot Angle Number of Leads Pitch Outside lead pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Lead Thickness Lead Width L1 b c Dimension Limits E E1 D L e1 A A2 A1 Units N e 0° 0.08 0.20 - - - 10° 0.26 0.51 MILLIMETERS 0.95 BSC 1.90 BSC 0.30 0.90 0.89 0.00 0.60 REF 2.90 BSC 0.45 2.80 BSC 1.60 BSC 1.15 - - MIN 6 NOM 1.45 1.30 0.15 0.60 MAX Ø |
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