L6235

20/25

Figure 24. PowerDIP24 Junction-Ambient thermal resistance versus on-board copper area.

Figure 25. SO24 Junction-Ambient thermal resistance versus on-board copper area.

Figure 26. Mounting the PowerSO Package.

39

40

41

42

43

44

45

46

47

48

49

1

2

3

4

5

6

7

8

9

101112

C opper Are a is on Bo ttom

Sid e

C opper Are a is on To p S i de

sq . cm

ºC / W

On-Board Copper Area

48

50

52

54

56

58

60

62

64

66

68

123

45

6789

10

11

12

C o pp er A rea is o n T op S ide

sq. cm

ºC / W

On-Board Copper Area

Slug soldered

to PCB with

dissipating area

Slug soldered

to PCB with

dissipating area

plus ground layer

Slug soldered to PCB with

dissipating area plus ground layer

contacted through via holes