OP162/OP262/OP462

Rev. F | Page 6 of 20

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Min

Supply Voltage

±6 V

Input Voltage1

±6 V

Differential Input Voltage2

±0.6 V

Internal Power Dissipation

SOIC (S)

Observe Derating Curves

MSOP (RM)

Observe Derating Curves

TSSOP (RU)

Observe Derating Curves

Output Short-Circuit Duration

Observe Derating Curves

Storage Temperature Range

–65°C to +150°C

Operating Temperature Range

–40°C to +125°C

Junction Temperature Range

–65°C to +150°C

Lead Temperature Range

(Soldering, 10 sec)

300°C

or equal to the supply voltage.

limited to less than 5 mA to prevent degradation or destruction of the input

devices.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operation section

of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Table 5.

Package Type

θJA1

Unit

8-Lead SOIC (S)

157

56

°C/W

8-Lead TSSOP (RU)

208

°C/W

8-Lead MSOP (RM)

190

44

°C/W

14-Lead SOIC (S)

105

°C/W

14-Lead TSSOP (RU)

148

°C/W

____________________________

device soldered in circuit board for SOIC, MSOP, and TSSOP packages

.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.