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Os motores de busca de Datasheet de Componentes eletrônicos |
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Os motores de busca de Datasheet de Componentes eletrônicos |
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XM33C321ASPZR Folha de dados(PDF) 39 Page - Texas Instruments |
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XM33C321ASPZR Folha de dados(HTML) 39 Page - Texas Instruments |
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39 / 113 page  (3) Wait states are managed automatically by the system controller (SYSCTL) and do not need to be configured by application software unless 7.4 Thermal Information THERMAL METRIC(1) PACKAGE VALUE UNIT RθJA Junction-to-ambient thermal resistance LQFP-100 (PZ) TBD °C/W RθJC(top) Junction-to-case (top) thermal resistance TBD °C/W RθJB Junction-to-board thermal resistance TBD °C/W ΨJT Junction-to-top characterization parameter TBD °C/W ΨJB Junction-to-board characterization parameter TBD °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W RθJA Junction-to-ambient thermal resistance LQFP-80 (PN) TBD °C/W RθJC(top) Junction-to-case (top) thermal resistance TBD °C/W RθJB Junction-to-board thermal resistance TBD °C/W ΨJT Junction-to-top characterization parameter TBD °C/W ΨJB Junction-to-board characterization parameter TBD °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W RθJA Junction-to-ambient thermal resistance LQFP-64 (PM) TBD °C/W RθJC(top) Junction-to-case (top) thermal resistance TBD °C/W RθJB Junction-to-board thermal resistance TBD °C/W ΨJT Junction-to-top characterization parameter TBD °C/W ΨJB Junction-to-board characterization parameter TBD °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W RθJA Junction-to-ambient thermal resistance VQFN-48 (RGZ) TBD °C/W RθJC(top) Junction-to-case (top) thermal resistance TBD °C/W RθJB Junction-to-board thermal resistance TBD °C/W ΨJT Junction-to-top characterization parameter TBD °C/W ΨJB Junction-to-board characterization parameter TBD °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance TBD °C/W RθJA Junction-to-ambient thermal resistance LQFP-48 (PT) TBD °C/W RθJC(top) Junction-to-case (top) thermal resistance TBD °C/W RθJB Junction-to-board thermal resistance TBD °C/W ΨJT Junction-to-top characterization parameter TBD °C/W ΨJB Junction-to-board characterization parameter TBD °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W RθJA Junction-to-ambient thermal resistance VQFN-32 (RHB) TBD °C/W RθJC(top) Junction-to-case (top) thermal resistance TBD °C/W RθJB Junction-to-board thermal resistance TBD °C/W ΨJT Junction-to-top characterization parameter TBD °C/W ΨJB Junction-to-board characterization parameter TBD °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance TBD °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.5 Supply Current Characteristics www.ti.com MSPM33C321A, MSPM33C3219 SLASFB6 – DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 39 Product Folder Links: MSPM33C321A MSPM33C3219 |
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