Page 10 of 11

Package Outline and Assembly

0.65

1.00

A2

0

E

E2

L

D2

e

K

b

D

0.16

0.20

1.50

0.20

3.00 BSC

0.26

0.36

1.65

1.80

0.50

-

-

0.25

0.30

3.00 BSC

NOM

0.20 REF

MIN

A3

0.80

A

MAX

0.90

1.00

1.50

1.65

1.80

A2

A

D

E

0.00-0.05

INDICATOR

PIN 1

1. ALL DIMENSIONS ARE IN mm

NOTE:

1.00

±.005

PACKAGE OUTLINE

0.30 ±.005

0.50

BSC

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.40 ±.05

(4 SIDES)

2.00 ±.05

4.00 ±.05

A3

CMM2000-QT

AAAA

PYYWWG

CMM2000-QT

AAAA: Wafer Lot Number

P: Country of Origin

YYWW: Date Code (Year/Week)

G: Plating Origin

1.5-6.0 GHz GaAs MMIC

Packaged Driver Amplifier

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2008 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

January 2008 - Rev 28-Jan-08