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STTH1R04AY Folha de dados(PDF) 6 Page - STMicroelectronics |
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STTH1R04AY Folha de dados(HTML) 6 Page - STMicroelectronics |
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6 / 12 page ![]() Characteristics STTH1R04-Y 6/12 DocID024449 Rev 2 Figure 13: Thermal resistance junction to ambient total versus copper surface under each lead (SMB) R th (j -a) ( C/W) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SMB ° S CU(cm²) epoxy printed board FR4, copper thickness Cu = 35 µm |
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