UCD3138A64PFC datasheet(10/84 Pages) TI2

10 / 84 page

UCD3138128, UCD3138A64

SLUSBZ8B – JUNE 2014 – REVISED FEBRUARY 2017

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Pin Functions (continued)

NAME

PRIMARY ASSIGNMENT

ALTERNATE ASSIGNMENT

CONFIGURABLE

AS A GPIO?

NO. 1

NO. 2

AGND

Analog ground

EAP0

Channel #0, differential analog voltage, positive input

EAN0

Channel #0, differential analog voltage, negative input

EAP1

Channel #1, differential analog voltage, positive input

EAN1

Channel #1, differential analog voltage, negative input

EAP2

Channel #2, differential analog voltage, positive input

EAN2

Channel #2, differential analog voltage, negative input

AGND

Analog ground

V33A

Analog 3.3V supply

AD00

12-bit ADC, Ch 0, Connected to current source

AD01

12-bit ADC, Ch 1, Connected to current source

AD02

12-bit ADC, Ch 2, Connected to comparator A, I-share

AD05

12-bit ADC, Ch 5

AD14

12-bit ADC, Ch 14

AD08

12-bit ADC, Ch 8

AD09

12-bit ADC, Ch 9

AD11

12-bit ADC, Ch 11

AGND

Analog ground

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Referenced to DGND

8 Specifications

8.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

MIN

MAX

V33D

V33D to DGND

–0.3

3.8

V33DIO

V33DIO to DGND

–0.3

3.8

V33A

V33A to AGND

–0.3

3.8

BP18

BP18 to DGND

-0.3

2.5

|DGND – AGND|

Ground difference

0.3

RTC_IN_1_8/RSVD

-0.3

3.0

All Pins, excluding

AGND(2)

Voltage applied to any pin

–0.3

3.8

TOPT

Junction Temperature

–40

125

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

–55

150

°C

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

pins(1)

–2000

2000

Charged device model (CDM), per JEDEC specification

JESD22-C101, all pins(2)

–500

500

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