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STPS2045CH Folha de dados(PDF) 5 Page - STMicroelectronics |
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STPS2045CH Folha de dados(HTML) 5 Page - STMicroelectronics |
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5 / 9 page ![]() 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 IPAK package information • Cooling method: by conduction (C) • Epoxy meets UL 94,V0 Figure 8. IPAK package outline D V1 A c2 H L b2 A1 e1 e b c L2 L1 E b4 B5 STPS2045CH Package information DS8991 - Rev 3 page 5/9 |
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