Table 5. Isolation and safety-related specifications

Parameter

Symbol

Value

Unit

Conditions

Minimum External Air Gap (External

Clearance)

CLR

8

mm

Measured from input terminals to output terminals,

shortest distance through air

Minimum External Tracking (External

Creepage)

CPG

8

mm

Measured from input terminals to output terminals,

shortest distance path along body

Tracking Resistance

(Comparative Tracking Index)

CTI

≥ 400

V

IEC 60112

Isolation Group

-

II

-

according to IEC 60664-1

Overvoltage Category per

IEC 60664-1

I - IV

-

Rated Mains voltages ≤ 150 VRMS

I - III

-

Rated Mains voltages ≤ 300 VRMS

I - II

-

Rated Mains voltages ≤ 600 VRMS

I

-

Rated Mains voltages ≤ 1000 VRMS

Table 6. Absolute maximum ratings

Parameter

Symbol

Min.

Max.

Units

Storage temperature

TS

-55

150

°C

Operating temperature

TA

-40

125

°C

Supply voltage

VDD, VDDISO

-0.3

6

V

Steady-state input

voltage

VIN+, VIN-

-0.3

VDDISO + 0.5

V

Digital input/output

voltages

MDAT+, MDAT-

MCLKIN+, MCLKIN-

-0.3

VDD + 0.5

V

Lead solder

temperature

260 for 10 s.

°C

Table 7. Recommended Operating Conditions

Parameter

Symbol

Min.

Max.

Units

Ambient operating temperature

TA

-40

125

°C

VDD supply voltage

VDD

3

5.5

V

VDDISO supply voltage

VDDISO

4.5

5.5

V

Analog input voltage

VIN+, VIN-

-200

200

mV

Table 8. Electrical specifications

VDD=3 V to 5.5 V, VDDISO = 4.5 to 5.5 V, VIN+ = -200 mV to +200 mV, TA=-40 to 125 °C, fMCLKIN=5 to 25MHz unless otherwise

noted.

Parameter

Symbol

Min.

Typ.

Max.

Units

Test conditions

STATIC CHARACTERISTICS

Resolution

16

bits

with SINC3 filter with OSR=256 and

VIN+ - VIN-=200 mV

Integral nonlinearity

INL

±3

LSB

ISOSD61

Device specifications

DS13605 - Rev 11

page 6/23